- 【Fine-Diameter Precision】: 0.8 mm solder wire ensures controlled flow for circuit boards, Arduino kits, and miniature RC models; Minimizes waste with 50g portable spool.
- 【Optimized Alloy Ratio】: Sn60-Pb40 composition balances strength (38 MPa tensile) and 183°C low melting point; Suitable for heat-sensitive IC chips.
- 【Rosin Flux Performance】: 1.8% non-corrosive core eliminates oxidation; Complies with ISO 9453 flux reactivity standards.
- 【Smooth Joint Formation】: Rapid wetting reduces cold solder risk; Matte finish indicates proper intermetallic bonding.
- 【Multi-Application Scope】: PCB repairs, jewelry crafting, automotive sensors; Not recommended for water supply systems.
Product Description
WARNING: This product can expose you to chemicals including Lead which is known to the State of California to cause cancer and birth defects or other reproductive harm. Remind to wash your hands after using it.
Specification
| Brand | HengTianMei |
| Tin to Lead Content Ratio | Tin 60%- Lead 40% (Sn60-Pb40) |
| Melting Point | 361°F/183°C |
| Diameter | 0.8 mm/0.031 inch/20 gauge |
| Solder wire flux content | 1.80% |
| Weight | 50g/1.76oz |
What is the use of rosin cores?
This solder wire contains a rosin core, so it helps its fluidity and use effect, so that when soldering tin drops can quickly stick to the circuit board, and the solder joint will be very full.
Because the rosin core as a flux its melting point is lower than the solder material, weight, viscosity, and surface tension are smaller than the solder wire, so when soldering, the flux melts first and quickly covers the surface of the solder, playing a role in isolating the air to prevent oxidation of the metal surface.
And can react with the solder and the surface oxide film of the metal to be soldered under the high temperature of welding, so that it melts and restores the pure metal surface.
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