Free Shipping Site Wide!

LEOWAY Resin 3D Printer Dustproof Blackout Cover Protection from Sunlight Dust Dirt Spill for SLA 3D Printer Elegoo Saturn, Anycubic Photon Mono X, Phrozen Sonic 4K, Phrozen Sonic Mighty 4K

$35.99

Clear

Description
  • LEOWAY resin 3D printer blackout cover keeps your resin 3D printer free of dust, UV rays, and moisture, protects from damage, and helps contain stray resin fumes. Also can reduce the adverse effects on the printer’s work to improve print stability in cold weather.
  • Size L W H: 12 L x 12 W x 18 H in/ 305 x 305 x 458 mm, compatible with Elegoo Saturn, Anycubic Photon Mono X, Phrozen Sonic 4K, Phrozen Sonic Mighty 4K, and other 8.9-inch Resin 3D printers.
  • Save Your Time: Now you’re no longer forced to tidy up your printer right after a printing process. Use 3D printer blackout cover to keep the device secure until you have time for cleaning.
  • Durable: Made of soft PVC laminated polyester, built to last. It is waterproof and safe from tears and abrasion while remaining very flexible.
  • Convenient Design : 3″ flaps on all four sides allow easy access to printer controls and ports. Any questions or issues about the product please feel free to contact us.

Specification:
Item Type: 3D Printer Enclosure Dust Cover
Width: 305mm / 12in
Length: 305mm / 12in
Height: 458mm / 18in
Application:
Fit for Elegoo Saturn, Anycubic Photon Mono X, Phrozen Sonic 4K,Phrozen Sonic Mighty 4K
Package List:
1 x Printer Dust Cover

Additional information
Part Number

5.5UVPCOVER-AU

Manufacturer reference

5.5UVPCOVER-AU

Country/Region of origin

China

Batteries Included

No

Batteries Required

No

Brand

LEOWAY

Package Dimensions

29.8 x 18.5 x 3.2 cm; 270 Grams

Item Weight

270 g

Manufacturer

LEOWAY

Reviews (0)

Reviews

There are no reviews yet.

Be the first to review “LEOWAY Resin 3D Printer Dustproof Blackout Cover Protection from Sunlight Dust Dirt Spill for SLA 3D Printer Elegoo Saturn, Anycubic Photon Mono X, Phrozen Sonic 4K, Phrozen Sonic Mighty 4K”

Your email address will not be published. Required fields are marked *